Specialized rotary joint for semiconductor wafer thinning equipment
Specialized rotary joint for semiconductor wafer thinning equipment
Specialized rotary joint for wafer thinning equipment
1. Features
1) Strong dust resistance. Specialized structural design, suitable for transporting liquids containing dust and particulate matter, with no high requirements for fluid cleanliness;
2) Low starting torque, equipment starts smoothly;
3) Modular design reduces customer procurement costs;
4) Small size helps reduce the height of customer devices;
5) Low heat generation, can be installed in enclosed spaces for a long time;
1. Features
1) Strong dust resistance. Specialized structural design, suitable for transporting liquids containing dust and particulate matter, with no high requirements for fluid cleanliness;
2) Low starting torque, equipment starts smoothly;
3) Modular design reduces customer procurement costs;
4) Small size helps reduce the height of customer devices;
5) Low heat generation, can be installed in enclosed spaces for a long time;
2. Technical indicators
| Medium | vacuum | compressed air | water |
| Pressure (Kpa) | -90 | 500 | 500 |
| Speed (rpm) | high 500 common 300 | ||
| Fluid diameter (mm) | 4/5 | ||