Semiconductor cutting machine high-speed rotary joint

Semiconductor cutting machine high-speed rotary joint

characteristic
1) The speed reaches up to 3000rpm,
2) Low torque;
3) Long lifespan, adopting a special structural design, equipped with automatic air cooling heat dissipation, and almost frictionless rotation;
4) Compact structure, suitable for installation in narrow spaces;
5) Small axial runout, especially suitable for cutting machines.
technical indicators